International Conference on Material Science Engineering and Smart Materials
About the Conference
With the support of the prestigious Scopus indexed MDPI Journal of Materials (ISSN:1996-1944) and the International Journal of Engineering and Applied Physics (ISSN: 2737-8071), Scientex Conference invites all motivated participants to attend our wide Smart Materials Conference, which will take place in Vienna, Austria from 12-13 November 2021, under the theme “Renovating the trends of researchers in smart materials”. Smart Materials 2021 is a scientific conference containing keynote addresses, general oral presentation workshops, panel discussions, networking sessions of engineering experts, Materials Science, Electronics and Electricals, Biomaterials, Non Materials, Sensors, Electronics, Photonics, Physics, Chemistry, Polymers, and other Materials Science collaboration arenas. The key slogan of the Smart Materials 2021 is to provide a venue for scholars, scientists, researchers, businessmen, industrial professionals, and students to show all their research work and provide a forum for exchanging ideas and ideas to solve the problems that our the planet is putting before us in the future from the point of evolving science and engineering techniques and technologies. Smart Materials 2021 emphasizes the growing basic needs for energizing modern-day issues with creative engineering solutions with full outreach capacity. This would therefore be a great networking setup and a solid basement for an everlasting bond that lasts forever amongst peers. On behalf of our beloved Organizing Committee, we welcome you all to this experienced forum involving the proper participation of renowned researchers, scientists, and other allied people from different countries around the globe in sharing their thrilling, fashionable Material Science World outcomes. Smart Materials 2021 is the premier interdisciplinary forum in the area of Smart Materials Applications for the presentation of technological developments and test findings. The conference will bring together the world’s leading academic scientists, academics, and scholars in the area of interest.
Event poster
Abstract
Honeycomb lattice structures are lightweight and have high strength to weight ratio. Hence, such structures have gathered a significant amount of attraction over the last decade. Many experimental and analytical studies have been carried out to determine the in-plane elastic properties of these lattice structures. Once manufactured, it is impossible to vary the properties of these lattice structures. However, for hybrid lattice structures, the elastic properties can be altered by applying voltage. This article presents a hybrid lattice structure constructed by bonding piezoelectric patch on the inclined cell walls. A bottom-up approach has been used to obtain the closed-form expressions for elastic properties of the hybrid lattice structure. The elastic properties (E1andE2) emerged to vary under the combined influence of externally applied stress and voltage. Moreover, an in-depth study has been presented to understand the variation of the elastic properties of the hybrid lattice structures with the variation in the governing parameters such as length, cell angle, thickness, the width of the substrate and the piezoelectric layer and the externally applied stress and voltage. A significant effect in Young’s modulus has been observed while switching between unimorph and bimorph configurations for the same aspect ratio of the lattice structure. This study intends to provide a good intuition while selecting the dimension of the lattice structure for the desired application. This article provides an extensive overview of the practical application of these active hybrid lattice structures in future devices.
