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This is a confocal thin-film deposition tool in sputter-up configuration, equipped with three RF/DC magnetron guns. Dielectric materials such as SiO2, TiO2, ZnO, Al2O3, and metal films such as Au, Ag, Pt, Cu and Zn can be deposited. Target to substrate distance is adjustable to achieve desired uniformity and deposition rate. The system can process wafers up to 2” in diameter. With its multi-gun capability, co-sputtering, sequential sputtering and reactive sputtering (with active gas mixtures) are possible.
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